pcba

Recently, the Songshan Lake Materials Laboratory's third-generation semiconductor team, in collaboration with Professor Jincheng Zhang and Professor Xiangdong Li from Academician Yue Hao's group at Xidian University, and Guangdong Zhien Technology Co., Ltd., successfully developed high-performance GaN HEMTs wafers based on 2-6 inch AlN single crystal composite substrates.

Global semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) will participate in the world-leading trade show for electronic components, systems, applications, and solutions—electronica 2024—which will be held from November 12 to 15 in Munich, Germany. ROHM's booth will be located at C3-520, where it will showcase its advanced power and analog technologies aimed at improving power density, efficiency, and reliability in automotive and industrial applications. These technologies are crucial for meeting the growing demands of modern electronic systems, particularly in the context of sustainability and innovation.

The creation of Printed Circuit Boards (PCB) is a precise and multi-step procedure that turns a circuit board design into a tangible, functional electronic device. Here’s a streamlined walkthrough of the process, tailored for those interested in the intricacies of PCB fabrication.

Surface-Mount vs. Through-Hole Soldering: Which is Best for Your Project?