Архивы за месяц: Март 2025

At the Infineon Consumer, Computing & Communication Innovation Conference 2025 (ICIC 2025), Infineon made waves by showcasing a powerful lineup of next-generation semiconductor technologies, catering to key trends such as artificial intelligence (AI), robotics, edge computing, and gallium nitride (GaN) applications.

UNIS, a brand under the new Unigroup umbrella, has officially launched two new PCIe 5.0 SSDs — the UNIS SSD S5 and UNIS SSD S5 Ultra — delivering cutting-edge speed, thermal management, and storage performance tailored for gaming, AI computing, and professional workloads.

Seagate has officially refreshed its popular BarraCuda lineup with three new high-capacity models: 16TB, 20TB, and 24TB. These 3.5-inch hard drives mark a significant step forward for the series, which has long catered to the mainstream consumer market but had previously been limited to capacities under 10TB and lacked helium-sealed drives.

DURHAM, North Carolina — March 31, 2025 — Wolfspeed (NYSE: WOLF), a global leader in silicon carbide (SiC) technologies, has announced the appointment of Robert Feurle as the company’s next Chief Executive Officer, effective May 1, 2025. Feurle will succeed interim CEO Thomas Werner, who will transition back to his role as Executive Chairman of the Board after the leadership handover.

At the recent GTC 2025 conference, NVIDIA CEO Jensen Huang unveiled the company’s forward-looking technology roadmap — one that highlights the next-generation “Rubin” GPU architecture. Now, new reports confirm that NVIDIA is collaborating with TSMC to leverage advanced chiplet-based packaging for Rubin GPUs, marking a significant evolution beyond the Blackwell architecture.

Russia has taken a significant step toward technological self-reliance in semiconductor manufacturing, unveiling its first domestically developed 350nm lithography machine, with orders already secured and plans underway for the development of a 130nm model.

As global semiconductor supply chains shift from centralized manufacturing to distributed innovation, Hong Kong is rapidly emerging as a key player. Backed by government policy, growing market demand, and regional synergies within the Greater Bay Area, the city is strategically investing in RISC-V architecture and third-generation semiconductor technologies—two of the most promising tracks in the chip industry today.

On March 26, Tower Semiconductor announced a strategic partnership with Alcyon Photonics, a leader in integrated photonics design, aimed at accelerating the development of next-generation optical applications. The collaboration will focus on delivering silicon-validated photonic building blocks (BBs) and circuits optimized for high performance, leveraging Tower’s high-volume SiPho (Silicon Photonics) platform.

Qualcomm President and CEO Cristiano Amon recently shared his enthusiasm for the rapid evolution of artificial intelligence (AI) during the 2025 China Development Forum. Highlighting breakthrough innovations like DeepSeek, Amon noted that AI is entering a transformative new phase—one where Qualcomm aims to deepen its collaborations with Chinese partners.

TSMC is making significant progress on its next-generation 2nm process, reaching a reported yield of 60%—a major milestone that signals the technology's readiness for commercial deployment. According to industry sources, the semiconductor giant will hold an expansion ceremony for its 2nm facilities in Kaohsiung on March 31, and officially begin accepting customer orders on April 1.

Global semiconductor leader AMD (Advanced Micro Devices) has officially opened its new office in Tainan, Taiwan, signaling a major step forward in the company’s AI development and regional presence. The opening ceremony was led by AMD Taiwan General Manager Chen Min-Hao and attended by Tainan Mayor Huang Wei-Che, who hailed the new site as a milestone in Tainan’s journey to becoming a hub for artificial intelligence.

Intel has officially announced the upcoming retirement of Dr. Ann Kelleher, Executive Vice President and Head of Technology Development, who has spent over 30 years shaping the company’s manufacturing innovation. She is expected to step down later this year, marking a major leadership transition just as Intel ramps up production of its 18A process node.