semiconductor equipment

On December 16, 2024, Jingsheng Mechanical and Electrical Co., Ltd. (Jingsheng) announced the official establishment of its Materials Research Institute in Japan. The new institute is part of the company's ongoing efforts to enhance R&D in silicon, sapphire, and silicon carbide (SiC) semiconductor substrates, further expanding its footprint in the global semiconductor and photovoltaic industries.

In recent years, despite the complex and changing international landscape, China's semiconductor industry continues to thrive, driven by an ongoing wave of domestic production. As a result, mergers and acquisitions (M&A) within the semiconductor sector have been on the rise, with companies expanding into areas like semiconductor equipment, silicon materials, and chip packaging materials. Notably, even some retail giants are stepping into the semiconductor space.

The localization of the semiconductor industry in China is a long-term proposition. Over recent years, the degree of localization across both upstream and downstream segments of China’s semiconductor industry chain has gradually improved. However, given the current volatile international and domestic situations, China’s semiconductor industry is being propelled to accelerate its development.

The Chinese semiconductor sector is experiencing a surge in new company formations across key areas such as chip design, manufacturing, equipment, packaging, and materials. This wave of startups is not only supported by significant investments from major companies like Zhongwei, Yangjie Technology, and Dinglong Co., but also bolstered by the injection of capital from advanced manufacturing industry investment funds. This development marks an important step in improving the supply chain and fostering technological independence in China’s semiconductor industry.

On November 28, Shanghai Wanye Enterprise Co., Ltd. announced that 11 limited partners, including Hongtianyuan Management and Shenhongyuan Management, have transferred their entire stake in Hongtianyuan Partnership to Lead Technology and its subsidiary, Lead Hunter.

Recently, Xiner Technology announced the commencement of its Phase II plant expansion at the Emerging Industrial Park. The new facility will cover an area of 2,000 square meters, primarily housing a Class 100 cleanroom. This expansion aims to enhance the development and manufacturing capabilities for high-end equipment, including 12-inch temporary bonding and debonding, permanent bonding, and hybrid bonding machines.