On February 5, 2025, Yageo Corporation announced its plan to acquire 100% of Shibaura Electronics, a publicly traded Japanese company, in a deal valued at ¥65.56 billion JPY (approximately NT$14 billion or $430 million USD). This acquisition marks the first major cross-border merger and acquisition (M&A) deal initiated by a Taiwanese publicly listed company in the Year of the Dragon.
electronic components
Recently, the Songshan Lake Materials Laboratory's third-generation semiconductor team, in collaboration with Professor Jincheng Zhang and Professor Xiangdong Li from Academician Yue Hao's group at Xidian University, and Guangdong Zhien Technology Co., Ltd., successfully developed high-performance GaN HEMTs wafers based on 2-6 inch AlN single crystal composite substrates.
Global semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) will participate in the world-leading trade show for electronic components, systems, applications, and solutions—electronica 2024—which will be held from November 12 to 15 in Munich, Germany. ROHM's booth will be located at C3-520, where it will showcase its advanced power and analog technologies aimed at improving power density, efficiency, and reliability in automotive and industrial applications. These technologies are crucial for meeting the growing demands of modern electronic systems, particularly in the context of sustainability and innovation.
Infineon Launches World's Thinnest Silicon Power Wafer, Deliveries to First Customers Completed
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