chip manufacturing

ASML has released its 2024 annual report, emphasizing the theme of "Shaping the Future of Technology Together." The report outlines the company’s strategic priorities for 2025 and beyond, with a strong focus on aligning with customer technology roadmaps and minimizing transition costs for next-generation lithography tools.

Fujian Jingxu Semiconductor Technology Co., Ltd. (Jingxu Semiconductor) has achieved a significant milestone as the main factory building for its Phase II project in the Shanghang Industrial Park's Jin-Tong Industrial Zone is now complete. The project has progressed to interior and exterior wall finishing, with mechanical, electrical, and ventilation installations, along with fine-tuning, slated to begin after the Lunar New Year.

Intel CEO Pat Gelsinger's retirement marks a pivotal moment for the company, especially as it continues to navigate its IDM 2.0 strategy. This strategy, introduced by Gelsinger, aims to restore Intel’s leadership in the semiconductor industry, particularly in chip manufacturing and foundry services, through significant investments in manufacturing facilities and technological innovation.

On November 29th, JCET Group (Changjiang Electronics Technology Co., Ltd.) announced in an evening report that the transaction in which the National Integrated Circuit Industry Investment Fund (Big Fund) and Chipwise Semiconductor (Shanghai) Co., Ltd. transferred their 22.53% stake in JCET to Panstone Ruinqi (Shenzhen) Information Management Co., Ltd., a subsidiary of China Resources Group, has received approval from the State Administration for Market Regulation and the Korea Fair Trade Commission. The transaction has now been fully completed.

On November 12, according to an announcement on TSMC's official website, the company has approved an allocation of approximately $15.48 billion. This funding will be primarily used for the construction of new wafer fabs, installation of facility systems, and deployment of advanced node capacity.

According to a recent report by Tom's Hardware, Intel has decided to extend the pause on its wafer fab construction plan in Magdeburg, Germany, with the restart now postponed until 2029 or 2030. If fully implemented, this measure will not only affect the development of Germany's semiconductor industry but also bring attention to the €10 billion in subsidies initially allocated to Intel, raising discussions on whether these funds should be reallocated.