intel 18a process

On April 30, the 2025 Intel Foundry Direct Connect event kicked off with Intel showcasing major progress in its next-generation process nodes and advanced packaging technologies. The company also announced new ecosystem partnerships and customer collaborations as it continues evolving into a world-class foundry business.

Intel has officially announced the upcoming retirement of Dr. Ann Kelleher, Executive Vice President and Head of Technology Development, who has spent over 30 years shaping the company’s manufacturing innovation. She is expected to step down later this year, marking a major leadership transition just as Intel ramps up production of its 18A process node.

March 14, 2025 – In a significant milestone for Intel, the company has officially begun initial batch production of its 18A process wafers at its Arizona fab, marking a major step forward in its advanced semiconductor manufacturing roadmap. This development coincides with newly appointed CEO Lip-Bu Tan’s tenure, signaling Intel’s aggressive push to regain process technology leadership.

March 12, 2025 – The global semiconductor industry is witnessing a wave of executive reshuffles in 2025, with major players like Intel and Powerchip Semiconductor Manufacturing Corporation (PSMC) announcing leadership transitions.

March 12, 2025 – Intel has reaffirmed its commitment to outsourcing approximately 30% of its wafer production, with TSMC serving as a key external supplier. This strategic move, outlined by Intel's Vice President of Investor Relations, John Pitzer, during the Morgan Stanley Technology Conference, highlights Intel's long-term partnership with TSMC and its evolving manufacturing approach.

March 4, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC) has announced plans to increase its U.S. investment by an additional $100 billion, bringing its total investment in the country to $165 billion. This funding will support the construction of three new semiconductor fabs, two advanced packaging facilities, and a major R&D center in the United States.

Intel has officially launched production using the first two High-NA Extreme Ultraviolet (EUV) lithography machines from ASML, marking a significant step forward in semiconductor manufacturing technology. Early results indicate that these cutting-edge machines are already outperforming previous models in terms of reliability, potentially reshaping Intel’s competitive edge in chip fabrication.

Intel has officially announced that its cutting-edge 18A process node (1.8nm) is ready for tape-out and is expected to finalize design execution in the first half of 2025. This development marks a significant leap in semiconductor manufacturing technology and positions Intel as a serious contender in the race for advanced chip production.

Intel is reportedly in discussions with Taiwan Semiconductor Manufacturing Company (TSMC) to create a joint venture that could involve TSMC engineers helping Intel's wafer fabs operate more efficiently. This move signals a strategic shift in Intel's semiconductor manufacturing approach, potentially splitting its wafer fabrication operations while collaborating with TSMC on advanced process technologies.

Intel CEO Pat Gelsinger's retirement marks a pivotal moment for the company, especially as it continues to navigate its IDM 2.0 strategy. This strategy, introduced by Gelsinger, aims to restore Intel’s leadership in the semiconductor industry, particularly in chip manufacturing and foundry services, through significant investments in manufacturing facilities and technological innovation.

The semiconductor industry continues to advance, with significant updates from leading players. On November 26, TSMC held an equipment installation ceremony at its first 12-inch wafer fab in Kaohsiung, Taiwan, marking a shift from construction to production for its 2nm process. Meanwhile, Intel announced a $7.86 billion subsidy agreement with the U.S. Department of Commerce to support its 12-inch wafer fabs and advanced packaging projects across Arizona, New Mexico, Ohio, and Oregon. The Ohio facility will focus on cutting-edge process technologies.