Monatliche Archive: November 2024

On November 29, Lianyun Technology (Hangzhou) Co., Ltd. (Lianyun Technology) successfully listed on the Shanghai Stock Exchange’s STAR Market, marking a significant milestone in China’s semiconductor and storage industry.

The Chinese semiconductor sector is experiencing a surge in new company formations across key areas such as chip design, manufacturing, equipment, packaging, and materials. This wave of startups is not only supported by significant investments from major companies like Zhongwei, Yangjie Technology, and Dinglong Co., but also bolstered by the injection of capital from advanced manufacturing industry investment funds. This development marks an important step in improving the supply chain and fostering technological independence in China’s semiconductor industry.

Driven by advancements in AI, IoT, 5G, and autonomous driving, the global demand for semiconductor equipment continues to grow, particularly in high-end chip manufacturing and advanced packaging. In response, multiple countries have ramped up investments to maintain competitiveness in the global semiconductor value chain. Notably, recent developments from China and Russia highlight their respective efforts to strengthen domestic capabilities in this critical industry.

On November 20, 2024, the MTS2025 Storage Industry Trends Conference took place in Shenzhen, hosted by global high-tech research firm TrendForce and Global Semiconductor Watch. The event brought together leading figures from the semiconductor storage and terminal industries, senior analysts, and over 1,000 professionals from across the supply chain. Lite-On Storage Technology, a subsidiary of KIOXIA Corporation, showcased its latest storage products and advanced technologies, engaging in in-depth discussions about storage trends and future developments.

On November 28, 2024, Zhongxin Semiconductor Co., Ltd. (hereafter "Zhongxin Semiconductor") held a completion and production line celebration for its IDM project (Integrated Device Manufacturer) for optoelectronic and power devices.

On November 28, Shanghai Wanye Enterprise Co., Ltd. announced that 11 limited partners, including Hongtianyuan Management and Shenhongyuan Management, have transferred their entire stake in Hongtianyuan Partnership to Lead Technology and its subsidiary, Lead Hunter.

Powerchip Semiconductor Manufacturing Corp (PSMC) is making significant strides at its Tongluo plant, introducing Interposer and 3D wafer stacking capabilities to meet the demands of large-scale customers. With a monthly capacity of 40,000 12-inch wafers at the new facility, PSMC is positioning itself as a key player in the 3D AI foundry sector, helping international clients seize opportunities in the booming AI market.

On November 27, Shenzhen released the "Action Plan for Promoting High-Quality Mergers and Acquisitions (2025-2027)" (Draft for Public Comment), which places special emphasis on industries like integrated circuits (IC). This comprehensive plan introduces 14 specific measures addressing assets, financing, support services, talent cultivation, and risk management, marking the first full disclosure of regional M&A policies since the "Six M&A Measures" were introduced.

The third-generation semiconductor material, silicon carbide (SiC), is witnessing rapid progress across multiple regions and companies. Recent updates include new SiC facility plans in Taiwan, supply agreements for electric vehicles, expanded production capacities, and groundbreaking innovations. Here’s a roundup of the latest developments:

The semiconductor industry continues to advance, with significant updates from leading players. On November 26, TSMC held an equipment installation ceremony at its first 12-inch wafer fab in Kaohsiung, Taiwan, marking a shift from construction to production for its 2nm process. Meanwhile, Intel announced a $7.86 billion subsidy agreement with the U.S. Department of Commerce to support its 12-inch wafer fabs and advanced packaging projects across Arizona, New Mexico, Ohio, and Oregon. The Ohio facility will focus on cutting-edge process technologies.

On November 26, 2024, Suzhou Xinrui Technology Co., Ltd. (Xinrui) and Shaoxin Laboratory officially signed a cooperation agreement to establish the "Wafer-Level Bonding Equipment and Materials Joint Laboratory." This milestone partnership marks the start of deep collaboration between the two entities, aiming to drive technological advancements and innovation in the semiconductor industry.

Shanghai is making significant strides in enhancing its computing infrastructure, focusing on expanding computing power capabilities, scaling intelligent computing deployment, and optimizing communication quality within computing networks.