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Founded in February 2021, Suzhou Xiner Technology is a semiconductor equipment developer. The company independently develops and manufactures specialized semiconductor equipment, acts as a distributor for both domestic and international semiconductor manufacturing equipment, and provides services for upgrading and refurbishing used equipment, disassembly, and trading of consumables.
In December 2022, Xiner Technology established a Class 1,000 ultra-clean workshop and office in Suzhou Industrial Park, intended for the research and production of large-size bonding equipment and laser bonding devices.
Xiner Technology's product applications span across various fields of the semiconductor industry, with process capabilities covering 2 to 12 inches. The company provides comprehensive solutions for temporary and permanent bonding and has already delivered nearly 100 units of compound semiconductor bonding equipment. In 2023, it introduced the 12-inch temporary bonding and debonding equipment for 2.5D/3D packaging.
