Intel has officially announced the upcoming retirement of Dr. Ann Kelleher, Executive Vice President and Head of Technology Development, who has spent over 30 years shaping the company’s manufacturing innovation. She is expected to step down later this year, marking a major leadership transition just as Intel ramps up production of its 18A process node.
advanced semiconductor nodes
The advanced packaging sector is witnessing unprecedented growth, with major semiconductor companies making substantial investments to expand capacity and enhance technologies. ASE Group (Advanced Semiconductor Engineering) is set to establish a new fan-out panel-level packaging (FOPLP) production line in Kaohsiung, while TSMC is accelerating its investment in both advanced process nodes and advanced packaging solutions.
The global semiconductor industry is facing significant challenges, as several major chip manufacturing projects experience halts, delays, or cancellations. Recent developments include the suspension of the GlobalFoundries-STMicroelectronics fab in France and the Sumitomo Electric SiC wafer factory in Japan, adding to earlier reports of disruptions at Wolfspeed and Intel facilities. These moves reflect shifting market dynamics, declining demand in certain segments, and strategic reassessments by key industry players.
The semiconductor industry continues to advance, with significant updates from leading players. On November 26, TSMC held an equipment installation ceremony at its first 12-inch wafer fab in Kaohsiung, Taiwan, marking a shift from construction to production for its 2nm process. Meanwhile, Intel announced a $7.86 billion subsidy agreement with the U.S. Department of Commerce to support its 12-inch wafer fabs and advanced packaging projects across Arizona, New Mexico, Ohio, and Oregon. The Ohio facility will focus on cutting-edge process technologies.
