On November 24, 2024, the Bosch Semiconductor project, located in the Changjiang District Electronics Information Industrial Park, announced the arrival of its equipment. This marks a major milestone for the facility, which is expected to commence trial production in the first half of 2025.
According to project officials, the equipment includes over a dozen imported large-scale machines, such as air compressors, chillers, and modular air conditioning units. These are primarily designated for the facility’s cleanroom system, designed to meet the production standards for 6-inch MEMS wafer lines and sensor manufacturing. The project began its design phase in May of this year and is now in the final stages of equipment installation. Chip manufacturing equipment is scheduled to arrive by the end of December, with trial production expected to begin shortly after. The facility aims to achieve a monthly capacity of 3,000 wafers (6-inch).
Bosch Semiconductor (Jiangxi) Co., Ltd. is a company focused on MEMS chips as its core business. Operating under an IDM (Integrated Device Manufacturer) model, it integrates the design, manufacturing, and packaging/testing capabilities of MEMS chips, while also specializing in the development and production of high-end smart sensors.
The company has already completed research and development for micro-nano MEMS chips. Its MEMS piezoelectric accelerometers and MEMS silicon speakers have received multiple patent applications. Bosch Semiconductor’s products and services are widely applied across consumer electronics, medical devices, industrial systems, and automotive electronics. The company has established strategic partnerships with prominent enterprises such as Huawei and BYD, as well as leading companies in the advanced life and health
