sic for electric vehicles

Two major Japanese semiconductor companies—ROHM Co., Ltd. and Mitsubishi Electric Corporation—have announced new product lines based on silicon carbide (SiC) technology. These next-generation power modules are designed to serve the growing demands of electric vehicles (EVs) and home appliances, leveraging SiC’s advantages in high voltage resistance, thermal stability, and energy efficiency.

Recent developments in the silicon carbide (SiC) semiconductor industry have seen two major players, Gree Electric and ChipLink Semiconductor, receiving new utility model patent approvals. These patents reflect ongoing advancements in SiC Schottky semiconductor devices and integrated ultra-barrier rectifiers, crucial for enhancing efficiency in power electronics.

New Wolfspeed SiC Manufacturing Facility to Begin Production in June 2025 Wolfspeed’s ambitious $5 billion silicon carbide (SiC) wafer fabrication plant is now nearing completion. According to recent reports, Wolfspeed expects to fully take over the facility by March 2025 and officially begin 8-inch (200mm) SiC wafer production in June 2025.

December 18, 2024 – Longsys Advanced's Wuhan Base marked a significant milestone as it welcomed the first batch of equipment into its facilities, signaling the start of its process validation phase. This major step brings the company closer to its goal of achieving full-scale production of silicon carbide (SiC) wafers by May 2025. The project is part of Longsys's strategy to strengthen its leadership in third-generation semiconductor manufacturing.