TSMC is making significant progress on its next-generation 2nm process, reaching a reported yield of 60%—a major milestone that signals the technology's readiness for commercial deployment. According to industry sources, the semiconductor giant will hold an expansion ceremony for its 2nm facilities in Kaohsiung on March 31, and officially begin accepting customer orders on April 1.
tsmc 2nm
With AI-driven demand surging due to groundbreaking advancements from ChatGPT and DeepSeek, the semiconductor industry is entering a new phase of high-performance computing. As 3nm chips are now in mass production, major chip manufacturers are racing to bring 2nm fabrication plants online, with 2025 set as a key milestone for trial and mass production. With the deadline fast approaching, the construction and development of 2nm fabs have entered a phase of full-scale acceleration.
Japanese semiconductor firm Rapidus has announced that its 2nm chip manufacturing facility is progressing smoothly, with trial production set to commence on April 1, 2025. The company will install over 200 production tools to facilitate the next-generation node fabrication.
The semiconductor industry continues to advance, with significant updates from leading players. On November 26, TSMC held an equipment installation ceremony at its first 12-inch wafer fab in Kaohsiung, Taiwan, marking a shift from construction to production for its 2nm process. Meanwhile, Intel announced a $7.86 billion subsidy agreement with the U.S. Department of Commerce to support its 12-inch wafer fabs and advanced packaging projects across Arizona, New Mexico, Ohio, and Oregon. The Ohio facility will focus on cutting-edge process technologies.
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