SPC5775EDK3MME3

More Information
Category	Embedded - Microcontrollers
Package case	416-BGA
Manufacturer	NXP USA Inc.
RoHS	1
Core Processor	e200z7
Speed	264MHz
RAM Size	512K x 8
Operating Temperature	-40°C ~ 125°C (TA)
Mounting Type	Surface Mount
Supplier Device Package	416-MAPBGA (27x27)
Base Product Number	SPC5775
Core Size	32-Bit Dual-Core
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR, Zipwire
Number of I/O	293
Program Memory Size	4MB (4M x 8)
Program Memory Type	FLASH
EEPROM Size	-
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	A/D 40x12b eQADCx2
Oscillator Type	External
Other Names	568-14629 935370091557 SPC5775EDK3MME3-ND

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