LPC55S04JBD64E

More Information
Category	Embedded - Microcontrollers
Package case	64-TQFP Exposed Pad
Manufacturer	NXP USA Inc.
RoHS	1
Core Processor	ARM® Cortex®-M33
Speed	96MHz
RAM Size	80K x 8
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Supplier Device Package	64-HTQFP (10x10)
Base Product Number	LPC55S04
Core Size	32-Bit
Connectivity	CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O	45
Program Memory Size	128KB (128K x 8)
Program Memory Type	FLASH
EEPROM Size	-
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Data Converters	A/D 9x16b SAR
Oscillator Type	Internal
Other Names	568-LPC55S04JBD64E 935408609551

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